Hexion EPON Resin 862 Low-Viscosity Bisphenol-F Epoxy

Hexion EPON Resin 862 Low-Viscosity Bisphenol-F Epoxy by Hexion (SKU: HEX-EPON862-DR) provides an ASTM D638 Tensile Strength of 86 MPa (12,473 psi), ASTM D648 Heat Deflection Temperature (HDT) of 108 °C (226 °F), ASTM D790 Flexural Strength of 130 MPa, and Brookfield viscosity of 3200 cPs.

Required companion cure and process materials for Hexion EPON Resin 862 Low-Viscosity Bisphenol-F Epoxy include: Matched Stoichiometric Amine Hardener (100:28 pbw), Carbon Fiber 3K/12K or E-CR Glass Fabrics, Peel Ply, Flow Media & Vacuum Bagging Film. Category Engineering Rule: STOICHIOMETRIC RATIO CRITICAL: Must be weighed strictly at manufacturer mix ratio (e.g., 100:28 or 100:34 by weight) with matched Amine Hardener. Requires post-cure at 60–80°C for full Tg.

Approved cross-referenced drop-in equivalents for Hexion EPON Resin 862 Low-Viscosity Bisphenol-F Epoxy in the North American ASTM index include PRO-SET INF-114, Gurit Prime 37. Direct head-to-head engineering comparisons are available against PRO-SET INF-114 High-Tg Carbon Infusion Epoxy, Gurit Prime 37 Infusion Epoxy System, Swancor 901 Bisphenol-A Epoxy Vinyl Ester.

Hexion EPON Resin 862 Low-Viscosity Bisphenol-F Epoxy is classified under US DOT 49 CFR and Transport Canada TDG as Class 9 Environmentally Hazardous (UN Number: UN3082). It ships from regional US hubs in Bay City, MI, Tampa, FL, Seattle, WA with a typical lead time of 1-3 Days. When ordered with Class 5.2 Organic Peroxides (MEKP UN3105), 49 CFR § 177.848 hazmat segregation applies.

Hexion EPON Resin 862 Low-Viscosity Bisphenol-F Epoxy is qualified for Vacuum Infusion (VARTM), Resin Transfer Molding (RTM), Post-Cure 60–80°C. Primary industrial applications include Carbon America's Cup Foils, Aerospace UAV Spars, Naval Minehunter Decks.